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product portofolio:
wafer cleaning systems / wetbenches
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The OPTIwet ST 75 Wet Process System is designed for single substrate processing. The OPTIwet ST 75 can be utilized for Cleaning, Developing, Lift-off, Etching or Resist Stripping. The optimized process chamber provides excellent process results, repeatability and safe handling of substrates up to 508 x 508 mm (20"x 20"). |
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The OPTIwet ST 60 Wet Process System is a new designed tool for single substrate wet process applications, like Cleaning, Developing, Etching or Resist Stripping. The optimized process chamber with interlocked chamber doors provides excellent process results, cleanliness, repeatability and safety operating for substrates up to 400 x 400 mm (16"x 16"). |
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The OPTIwet ST30 Wet Process System is a new designed tool for single substrate wet process applications, like cleaning, developing, etching, resist stripping or lift off. The optimized process chamber with interlocked chamber door provides excellent process results, cleanliness and repeatability for substrates up to 12"x 12" or wafers up to 300mm. |
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The OPTIwet SB30 extended (Wet Process Module) is a designed tool for single substrate wet process applications, like cleaning, developing, etching, resist stripping or lift off. The optimized process chamber with interlocked chamber door provides excellent process results, cleanliness and repeatability for substrates up to 12"x 12" or wafers up to 300mm.
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The OPTIwet SB30 (Wet Process Module is a designed tool for single substrate wet process applications, like cleaning, developing, etching, resist stripping or lift off. The optimized process chamber with interlocked chamber door provides excellent process results, cleanliness and repeatability for substrates up to 9"x 9" or wafers up to 300mm.
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The maximus 806 is a fully automatic and programmable cassette-to-cassette micro-cluster system. It can be equipped with modules as coater, developer, cleaning, HMDS vapor primer, hotplates and coolplates for wafer sizes from Ø 4” up to Ø 8”. Two robots, one for the I/O handling and one for the process-module handling are able to handle even fragile materials very gently.
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Lift-Off Cluster containing 3 process modules
The MAXIMUS 804 Lift-Off is a fully automatic and programmable Cassette-to-Cassette Micro-Cluster System. It can be equipped with modules as such Immersion Batch Soak, Lift-Off (Single Wafer), and Post cleaning for wafer sizes from Ø 2” up to Ø 8”.
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The maximus 804 is a fully automatic and programmable cassette-to-cassette micro-cluster system. It can be equipped with modules as coater, developer, cleaning, HMDS vapor primer, hotplates and coolplates for wafer sizes from Ø 2” up to Ø 8” and substrates from 2”x 2” up to 6”x 6”. |
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maximus 802 is a fully automatic and programmable cassette-to-cassette micro-cluster system. It can be equipped with modules as coater, developer, cleaning, HMDS vapor primer, hotplates and coolplates for wafer sizes from Ø 2” up to Ø 8” and substrates from 2”x 2” up to 6”x 6”. |
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OPTIspin SB 30 spinner module is a process tool for typical coating applications of wafers and other substrates. |
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OPTIspin ST 30 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the system provides excellent coating uniformity and repeatability for up to 300mm wafers or up to 9”x 9” substrates. It is also possible to perform developing, cleaning or drying applications with this spinner system. |
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The OPTIspin SB 20 spinner module is a process tool for typical coating applications of wafers and other substrates. |
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The OPTIspin SST 20 Spinner System is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates. It is also possible to perform developing, cleaning or drying applications with this spinner system. |
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The OPTIspin ST 20 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates. It is also possible to perform developing, cleaning or drying applications with this spinner system. |
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OPTIspin ST 22 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the spinner system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates, extended by hard/soft bake processes. It is also possible to perform developing, cleaning or drying applications with this spinner system. |
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The OPTIspin ST 23 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the spinner system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates, extended by hard/soft bake and a HMDS vapor prime process. |
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